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OEM / ODM : Double Injection Molding & Headphone Lower Housing 1x2 No:23306 & 23307-B

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xProduct Details
Features | Double-shot Molding | Size | 270.000 X 490.000 X 406.000 |
---|---|---|---|
IMM Tonnage | 180T | Mold Base P/N | DAI2740 808090 |
Slide | 4 | Lifter | 10 |
Part Material | PC PC+ABS | Type | Three-plates Mold |
Mold Weight | 900kg | ||
High Light | headphone lower housing hot runner mold,pc hot runner mold,pc hot runner injection molding |
Product Description
Headphone Lower Housing (1*2)
No.23306 &23307-B
The mold, with the part number DAI2740 808090, is a three-plates mold designed for double-shot molding. It has a mold size of 270mm in length, 490mm in width, and 406mm in height. |
The mold base weighs 900kg and requires an injection molding machine with a tonnage of 180T. It features 4 slides and 10 lifters for complex part ejection. The gate type used is a pin point gate, and the tool life is rated for 500,000 shots. |
The surface finish of the mold is polished to SPI-B1 standard. The cavity and core of the mold are made of hardened steel (12/S136), ensuring durability. The part material used is PC or PC+ABS, with a weight of 1.6g and a size of 55.01*21.4*11.5mm. The injection and runner type employed is a hot runner system. |
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